A few days ago MediaTek launched Dimensity 1100 and Dimensity 1200 chipset with 6nm technology. These chipsets are for high-quality smartphones. Now MediaTek is looking for the mid-rangers chipset. According to a report of DigiTimes, MediaTek Dimensity 700 & Dimensity 800 on the way now.
These will use a more mature node from TSMC, 10nm or 12nm. The focus with these chips will be on power efficiency, sub-6 5G connectivity plus multimedia and gaming performance.
We’ll see how that pans out as even the base Dimensity 700 is fabbed on TSMC’s 7 nm node (N7). MediaTek uses TSMC’s 1 nm node for the likes of the Helio G-series, including the budget offerings like Helio G35 and G25.
However, MediaTek is expected to launch the new Dimension 700 chip at some point in the April-June quarter. The new Dimension 800 chip will be on display at MWC 2021, currently scheduled for June 26-July 1 (of course, these dates may vary depending on how the situation in Europe develops).
So, let’s see when these chipset will launch in market. So, guys stay connected with us to know more.
