iPhone 15 Pro’s heating issues are unrelated to the 3nm chip from TSMC
iPhone 15 Pro’s heating issues are unrelated to the 3nm chip from TSMC. With substantial upgrades including a new titanium frame replacing the aluminum one, a USB-C connection, and the cutting-edge A17 Pro CPU manufactured using TSMC’s cutting-edge 3-nm technology, Apple just unveiled its iPhone 15 Pro line of devices.
iPhone 15 Pro’s heating issues are unrelated to the 3nm chip from TSMC
However, claims from a number of sites have surfaced claiming that the iPhone 15 Pro line of smartphones are having serious overheating problems. Initial theories and justifications suggested that the fundamental problem was TSMC’s struggles to produce high yields with their 3nm chips, and that this was why Apple was forced to employ lower-quality processors for this year’s Pro series.
However, well-known industry expert Ming-Chi Kuo has recently claimed that the heating issues are not caused by TSMC’s 3nm technology and are instead coming from a different source.
